Features
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Large size (~φ520mm)
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Ultra-high layer counts (~L68)
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High board thickness (~7.4mm)
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Durable of high current (~1A)
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Large size build-up (~φ480mm)
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Low bending & flatness
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Test device: DRAM, NAND Flash, SoC, LCD driver IC and CMOS image sensor
Sample PCB specifications
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Layers: 68
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Board size: φ480 mm
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Board thickness: 6.35 mm
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Material: Low-dk
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Structure: BVH
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Surface treatment: ENIGEG (Au: 2u")
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